Chip-to-Module Interconnections Using “Sea of Leads” Technology

Bakir, Muhannad S.; Reed, Hollie A.; Mulé, Anthony V.; Jayachandran, Joseph Paul; Kohl, Paul A.; Martin, Kevin P.; Gaylord, Thomas K.; Meindl, James D.

期刊名称MRS Bulletin
作者Bakir, Muhannad S.; Reed, Hollie A.; Mulé, Anthony V.; Jayachandran, Joseph Paul; Kohl, Paul A.; Martin, Kevin P.; Gaylord, Thomas K.; Meindl, James D.
卷第28卷
期第1期
印刷ISSN0883-7694
电子ISSN1938-1425
文件大小494.95KB
发表时间2003-1
DOI10.1557/mrs2003.19
页码61-67

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Chip-to-Module Interconnections Using “Sea of Leads” Technology