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[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Vibration Fatigue Test of Surface Mount Electronic Components

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Vibration Fatigue Test of Surface Mount Electronic Components

Wong, T. E.; Fenger, H. S.

作者Wong, T. E.; Fenger, H. S.
文件大小466.09KB
发表时间2003
DOI10.1115/ipack2003-35031
页码287-293

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