[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Tackling the Drop Impact Reliability of Electronic Packaging
Wong, E. H.; Lim, C. T.; Field, J. E.; Tan, V. B. C.; Shim, V. P. W.; Lim, K. M.; Seah, S. K. W.
- 作者Wong, E. H.; Lim, C. T.; Field, J. E.; Tan, V. B. C.; Shim, V. P. W.; Lim, K. M.; Seah, S. K. W.
- 文件大小914.36KB
- 发表时间2003
- DOI10.1115/ipack2003-35101
- 页码757-763