[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (Sunday 6 July 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 - Heat Transfer in Triangular Microchannels

• 作者Dickey, J. Todd; Lam, Tung T.
• 文件大小335.88KB
• 发表时间2003
• DOI10.1115/IPACK2003-35133
• 页码303-307