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[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I — Crack Initiation

[ASME ASME 2003 International Mechanical Engineering Congress and Exposition - Washington, DC, USA (November 15–21, 2003)] Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology - Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I — Crack Initiation

Kim, Donghyun; Mawer, Andrew; Masada, Glenn Y.; Moon, Tess J.
  • 作者Kim, Donghyun; Mawer, Andrew; Masada, Glenn Y.; Moon, Tess J.
  • 卷第2003卷
  • 文件大小494.28KB
  • 发表时间2003
  • DOI10.1115/IMECE2003-43236
  • 页码505-514
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