[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Analysis of ACF Contact Resistance

• 作者Constable, J. H.
• 文件大小244.85KB
• 发表时间2003
• DOI10.1115/IPACK2003-35061
• 页码123-130