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Copper/polyimide fabrication process for above-IC integration of high quality factor inductors

Copper/polyimide fabrication process for above-IC integration of high quality factor inductors

M.B. Pisani; C. Hibert; D. Bouvet; P. Beaud; A.M. Ionescu

作者M.B. Pisani; C. Hibert; D. Bouvet; P. Beaud; A.M. Ionescu
印刷ISSN0167-9317
文件大小487.95KB
发表时间2004
DOI10.1016/j.mee.2004.03.020
页码474-479

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