[IEEE 2004 International Symposium on Electromagnetic Compatibility - Silicon Valley, CA, USA (9-13 Aug. 2004)] 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) - Dynamically linked EM/circuit analysis methodology
- 作者Randhawa, H.; Williams, L.
- 文件大小322.83KB
- 发表时间2004
- DOI10.1109/ISEMC.2004.1349936
- 页码860-863
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