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The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness

The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part I: the effects of adhesive thickness

Gomatam, Rajesh R.; Sancaktar, Erol
  • 期刊名称Journal of Adhesion Science and Technology
  • 作者Gomatam, Rajesh R.; Sancaktar, Erol
  • 卷第18卷
  • 期第11期
  • 印刷ISSN0169-4243
  • 电子ISSN1568-5616
  • 文件大小971.28KB
  • 发表时间2004-01
  • DOI10.1163/1568561041588219
  • 页码1225-1243
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