The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressure
- 期刊名称Journal of Adhesion Science and Technology
- 作者Gomatam, Rajesh R.; Sancaktar, Erol
- 卷第18卷
- 期第11期
- 印刷ISSN0169-4243
- 电子ISSN1568-5616
- 文件大小2077.50KB
- 发表时间2004-01
- DOI10.1163/1568561041588228
- 页码1245-1261
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