Development of Textured Ni Substrates for Coated Conductor Prepared by Powder Metallurgy and Plasma Arc Melting Method

Lim, J.H.; Kim, K.T.; Kim, J.H.; Jang, S.H.; Joo, J.; Nah, W.; Hong, G.-W.; Ji, B.K.; Kim, C.-J.; Kim, J.H.; Jang, S.H.; Joo, J.; Nah, W.; Hong, G.-W.; Ji, B.K.; Kim, C.-J.

期刊名称IEEE Transactions on Appiled Superconductivity
作者Lim, J.H.; Kim, K.T.; Kim, J.H.; Jang, S.H.; Joo, J.; Nah, W.; Hong, G.-W.; Ji, B.K.; Kim, C.-J.; Kim, J.H.; Jang, S.H.; Joo, J.; Nah, W.; Hong, G.-W.; Ji, B.K.; Kim, C.-J.
卷第14卷
期第2期
印刷ISSN1051-8223
文件大小309.01KB
发表时间2004-06
DOI10.1109/tasc.2004.830415
页码1086-1089

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Development of Textured Ni Substrates for Coated Conductor Prepared by Powder Metallurgy and Plasma Arc Melting Method