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Effect of Partial Pressure of TiCl
<sub/>4</sub>
and NH
<sub/>3</sub>
on Chemical Vapor Deposition Titanium Nitride (CVD-TiN) Film Cl Content and Electrical Resistivity

Effect of Partial Pressure of TiCl ₄ and NH ₃ on Chemical Vapor Deposition Titanium Nitride (CVD-TiN) Film Cl Content and Electrical Resistivity

Jun, Keeyoung; Shimogaki, Yukihiro

期刊名称Japanese Journal of Applied Physics
作者Jun, Keeyoung; Shimogaki, Yukihiro
卷第43卷
印刷ISSN0021-4922
文件大小91.16KB
发表时间2004-3-26
DOI10.1143/jjap.43.l519

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