Materials Challenges for CMOS Junctions
Taylor, William J.; Rendon, Michael J.; Verret, Eric; Jiang, Jack; Capasso, Cristiano; Sing, Dave; Nguyen, Jen-Yee; Smith, James; Luckowski, Eric; Martinez, Arturo; Schaeffer, Jamie; Tobin, Phil
- 期刊名称MRS Proceedings
- 作者Taylor, William J.; Rendon, Michael J.; Verret, Eric; Jiang, Jack; Capasso, Cristiano; Sing, Dave; Nguyen, Jen-Yee; Smith, James; Luckowski, Eric; Martinez, Arturo; Schaeffer, Jamie; Tobin, Phil
- 卷第810卷
- 电子ISSN1946-4274
- 文件大小1430.25KB
- 发表时间2004-1
- DOI10.1557/PROC-810-C1.1