Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
- 期刊名称Journal of Electronic Packaging
- 作者Pucha, Raghuram V.; Tunga, Krishna; Pyland, James; Sitaraman, Suresh K.
- 卷第126卷
- 期第2期
- 印刷ISSN1043-7398
- 文件大小746.70KB
- 发表时间2004
- DOI10.1115/1.1756150
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