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Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

Solderability of electroless deposited Ni‐P coatings with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solder alloys

Li, Dezhi; Liu, Changqing; Conway, Paul P.

期刊名称Circuit World
作者Li, Dezhi; Liu, Changqing; Conway, Paul P.
卷第31卷
期第3期
印刷ISSN0305-6120
文件大小1032.92KB
发表时间2005-09
DOI10.1108/03056120510585054
页码32-39

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