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[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Cu bonding to co lowK wafers: a systematic study of the mechanical bonding process

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Cu bonding to co lowK wafers: a systematic study of the mechanical bonding process

Degryse, D.; Vandevelde, B.; Beyne, E.
  • 作者Degryse, D.; Vandevelde, B.; Beyne, E.
  • 文件大小1232.92KB
  • 发表时间2005
  • DOI10.1109/esime.2005.1502769
  • 页码41-48
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