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[IEEE ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005. - San Jose, CA (Nov. 6-10, 2005)] ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005. - Thermal via planning for 3-D ICs

[IEEE ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005. - San Jose, CA (Nov. 6-10, 2005)] ICCAD-2005. IEEE/ACM International Conference on Computer-Aided Design, 2005. - Thermal via planning for 3-D ICs

Cong, J.; Yan Zhang,

作者Cong, J.; Yan Zhang,
文件大小459.76KB
发表时间2005
DOI10.1109/iccad.2005.1560164
页码745-752

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