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[IEEE Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. - Kyoto, Japan (June 16-18, 2005)] Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. - 2.8Gb/s Inductively Coupled Interconnect for 3-D ICs

[IEEE Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. - Kyoto, Japan (June 16-18, 2005)] Digest of Technical Papers. 2005 Symposium on VLSI Circuits, 2005. - 2.8Gb/s Inductively Coupled Interconnect for 3-D ICs

Jian Xu, ; Wilson, J.; Mick, S.; Lei Luo, ; Franzon, P.

作者Jian Xu, ; Wilson, J.; Mick, S.; Lei Luo, ; Franzon, P.
文件大小1951.74KB
发表时间2005
DOI10.1109/vlsic.2005.1469403
页码352-355

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