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[IEEE Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design and Packaging and Components Failure Analysis - 2005 - Shanghai (2005.06.27-2005.06.29)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Evolution of Interconnects and Packaging

[IEEE Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design and Packaging and Components Failure Analysis - 2005 - Shanghai (2005.06.27-2005.06.29)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Evolution of Interconnects and Packaging

  • 文件大小22.61KB
  • 发表时间2005
  • DOI10.1109/hdp.2005.251428
  • 页码1-1
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