Microstructure and Properties of a 70vol.% SiCp/Al-12Si Composite for Electronic Packaging
- 期刊名称Materials Science Forum
- 作者Zhang, Q.; Xiu, Zi Yang; Song, Mei Hui; Wu, Gao Hui
- 电子ISSN1662-9752
- 文件大小903.08KB
- 发表时间2005
- DOI10.4028/www.scientific.net/MSF.475-479.881
- 页码881-884
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