[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys
Liu, Changqing; Hutt, David A.; Li, Dezhi; Conway, Paul P.
- 作者Liu, Changqing; Hutt, David A.; Li, Dezhi; Conway, Paul P.
- 文件大小873.32KB
- 发表时间2005
- DOI10.1115/ipack2005-73160
- 页码1819-1825