[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates
Choi, Woon; Ono, Shintaro; Yoshida, Seiichiro; Tomokage, Hajime
- 作者Choi, Woon; Ono, Shintaro; Yoshida, Seiichiro; Tomokage, Hajime
- 文件大小484.38KB
- 发表时间2005
- DOI10.1115/IPACK2005-73469
- 页码1989-1993