Nucleation and growth of intermetallics and gold clusters on thick tin layers in electroplating process

• 作者Dongwook Kim; Jongsung Kim; Gow L. Wang; Chin C. Lee
• 卷第393卷
• 印刷ISSN0921-5093
• 文件大小380.00KB
• 发表时间2005
• DOI10.1016/j.msea.2004.11.022
• 页码315-319