[IEEE 2006 IEEE International Reliability Physics Symposium Proceedings - San Jose, CA, USA (2006.03.26-2006.03.30)] 2006 IEEE International Reliability Physics Symposium Proceedings - Reliability in MEMS Packaging

• 作者Hsu, Tai-ran
• 文件大小208.74KB
• 发表时间2006
• DOI10.1109/RELPHY.2006.251251
• 页码398-402