发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Application of an Innovative Method for the Fatigue Characterisation of 15 μm Thick Epitaxial Polysilicon

[IEEE 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Como, Italy (24-26 April 2006)] 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems - Application of an Innovative Method for the Fatigue Characterisation of 15 μm Thick Epitaxial Polysilicon

Ferraris, E.; Fassi, I.; Del Sarto, M.
  • 作者Ferraris, E.; Fassi, I.; Del Sarto, M.
  • 文件大小1902.51KB
  • 发表时间2006
  • DOI10.1109/esime.2006.1644031
  • 页码1-7
← 返回【学霸图书馆】主页