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Improvement in high-temperature degradation by isotropic conductive adhesives including Ag–Sn alloy fillers

Improvement in high-temperature degradation by isotropic conductive adhesives including Ag–Sn alloy fillers

M. Yamashita; K. Suganuma

作者M. Yamashita; K. Suganuma
卷第46卷
印刷ISSN0026-2714
文件大小811.04KB
发表时间2006
DOI10.1016/j.microrel.2005.05.020
页码850-858

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