[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - A Nanocore/CMOS Hybrid System-on-Package (SoP) Architecture for Future Nanoelectronic Systems
Weerasekera, Roshan; Liu, Jian; Zheng, Li-rong; Tenhunen, Hannu
- 作者Weerasekera, Roshan; Liu, Jian; Zheng, Li-rong; Tenhunen, Hannu
- 文件大小106.26KB
- 发表时间2006
- DOI10.1109/hdp.2005.251425
- 页码1-4