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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Macro-Micro Modeling Analysis for High Density Packaged Flip Chips

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Macro-Micro Modeling Analysis for High Density Packaged Flip Chips

Yin, C.; Lu, H.; Bailey, C.; Chan, Y.
  • 作者Yin, C.; Lu, H.; Bailey, C.; Chan, Y.
  • 文件大小352.51KB
  • 发表时间2006
  • DOI10.1109/HDP.2005.251383
  • 页码1-4
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