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[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish

Syed, Ahmer; Kim, Tae; Cho, Young; Kim, Chang; Yoo, Min
  • 作者Syed, Ahmer; Kim, Tae; Cho, Young; Kim, Chang; Yoo, Min
  • 文件大小382.54KB
  • 发表时间2006
  • DOI10.1109/eptc.2006.342750
  • 页码404-411
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