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Thermal stress evolution in embedded Cu/low-k dielectric composite features

Thermal stress evolution in embedded Cu/low-k dielectric composite features

C. E. Murray; C. C. Goldsmith; T. M. Shaw; J. P. Doyle; I. C. Noyan

作者C. E. Murray; C. C. Goldsmith; T. M. Shaw; J. P. Doyle; I. C. Noyan
文件大小339.66KB
发表时间2006
DOI10.1063/1.2219727

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