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[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Global Trend in Electronics Manufacturing

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Global Trend in Electronics Manufacturing

Shangguan, Dongkai
  • 作者Shangguan, Dongkai
  • 文件大小48.77KB
  • 发表时间2006
  • DOI10.1109/hdp.2005.251430
  • 页码1-3
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