[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages
Wilson, J.; Lei Luo, ; Jian Xu, ; Mick, S.; Erickson, E.; Hsuan-Jung Su, ; Benson Chan, ; How Lin, ; Franzon, P.
- 作者Wilson, J.; Lei Luo, ; Jian Xu, ; Mick, S.; Erickson, E.; Hsuan-Jung Su, ; Benson Chan, ; How Lin, ; Franzon, P.
- 文件大小1779.92KB
- 发表时间2006
- DOI10.1109/ectc.2006.1645624
- 页码41-48