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The Effect of Tungsten Addition on the Thermal Stability and Microstructure in the Electroless Ni-P-W Composite Coating

The Effect of Tungsten Addition on the Thermal Stability and Microstructure in the Electroless Ni-P-W Composite Coating

Tien, Shih Kang; Wu, Fan Bean; Duh, Jenq Gong

期刊名称Key Engineering Materials
作者Tien, Shih Kang; Wu, Fan Bean; Duh, Jenq Gong
卷第313卷
电子ISSN1662-9795
文件大小2135.87KB
发表时间2006
DOI10.4028/www.scientific.net/KEM.313.83
页码83-90

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