Cooling structure for EMC shielded high frequency electronics
- 期刊名称IEEE Transactions on Components and Packaging Technologies
- 作者Siebert, W.P.
- 卷第29卷
- 期第1期
- 印刷ISSN1521-3331
- 电子ISSN1557-9972
- 文件大小1435.30KB
- 发表时间2006-3
- DOI10.1109/tcapt.2005.853176
- 页码155-163
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