[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Solder Pastes for Microwave Application

Nowottnick, Mathias; Scheel, Wolfgang; Pape, Uwe; Diehm, Rolf; Wiese, Joachim; Kempe, Wolfgang; Mallah, Marcel; Suppa, Manfred; Fink, Peter

作者Nowottnick, Mathias; Scheel, Wolfgang; Pape, Uwe; Diehm, Rolf; Wiese, Joachim; Kempe, Wolfgang; Mallah, Marcel; Suppa, Manfred; Fink, Peter
文件大小5878.63KB
发表时间2006
DOI10.1109/estc.2006.280036
页码415-420

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