![[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - The deposition and planarization of a conformal, 300 degrees C APCVD interlevel dielectric]()
[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - The deposition and planarization of a conformal, 300 degrees C APCVD interlevel dielectricWhite, L.K.; Shaw, J.M.; Kurylo, W.A.; Miszkowski, N.A. · 1988