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REMOVED: Guest Editorial: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

REMOVED: Guest Editorial: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Wymysłowski, Artur; Vandevelde, Bart; Andersson, Dag
  • 期刊名称Microelectronics Reliability
  • 作者Wymysłowski, Artur; Vandevelde, Bart; Andersson, Dag
  • 印刷ISSN0026-2714
  • 文件大小94.39KB
  • 发表时间2006-10
  • DOI10.1016/j.microrel.2006.09.001
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