Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure
- 作者M. Yamashita; K. Suganuma
- 卷第46卷
- 期第7期
- 印刷ISSN0026-2714
- 文件大小266.24KB
- 发表时间2006
- DOI10.1016/j.microrel.2005.07.112
- 页码1113-1118
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