[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Proceedings of technical papers
- 文件大小685.52KB
- 发表时间2007
- DOI10.1109/IMPACT.2007.4433552
Laser welding with activating fluxKuo, M.; Sun, Z.; Pan, D. · Science and Technology of Welding and Joining · 2001
Weldability of X100 linepipeThewlis, G. · Science and Technology of Welding and Joining · 2000
Transient liquid phase bondingGale, W.F.; Butts, D.A. · Science and Technology of Welding and Joining · 2004
Terminology in friction stir weldingThreadgill, P. L. · Science and Technology of Welding and Joining · 2007
ErratumScience and Technology of Welding and Joining · 2011
Multiscale characterisation of weldmentsVitek, J M; Babu, S S · Science and Technology of Welding and Joining · 2011
Surface deposits in laser brazingKlocke, F; Frank, S · Science and Technology of Welding and Joining · 2013
ErrataScience and Technology of Welding and Joining · 2013