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[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Nanopackaging: Nanotechnologies and electronics packaging

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Nanopackaging: Nanotechnologies and electronics packaging

Morris, James E.

作者Morris, James E.
文件大小56.53KB
发表时间2007
DOI10.1109/IMPACT.2007.4433610
页码251-254

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