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[IEEE 2007 25th International Conference on Computer Design ICCD 2007 - Lake Tahoe, CA, USA (2007.10.7-2007.10.10)] 2007 25th International Conference on Computer Design - Whitespace redistribution for thermal via insertion in 3D stacked ICs

[IEEE 2007 25th International Conference on Computer Design ICCD 2007 - Lake Tahoe, CA, USA (2007.10.7-2007.10.10)] 2007 25th International Conference on Computer Design - Whitespace redistribution for thermal via insertion in 3D stacked ICs

Wong, Eric; Lim, Sung Kyu

作者Wong, Eric; Lim, Sung Kyu
文件大小390.47KB
发表时间2007
DOI10.1109/ICCD.2007.4601912
页码267-272

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