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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Novel Co-Simulation Method for Analysis of Power Integrity and EMI in Electronic Packages with Large Number of Power/ground Vias

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Novel Co-Simulation Method for Analysis of Power Integrity and EMI in Electronic Packages with Large Number of Power/ground Vias

Oo, Zaw Zaw; Enxiao, Liu; Chang, Wei Xing; Li Erping, ; Kee, Chua Eng; Li Le-Wei,
  • 作者Oo, Zaw Zaw; Enxiao, Liu; Chang, Wei Xing; Li Erping, ; Kee, Chua Eng; Li Le-Wei,
  • 文件大小484.90KB
  • 发表时间2007
  • DOI10.1109/eptc.2007.4469749
  • 页码421-424
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