[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Micro Embossing of LTCC (Low Temperature Co-fired Ceramic) Green Substrates
- 作者Maw, Hla Phone; Wai, Shi Chee; Tjeung, Ricky T.; Lu Chee Wai, ; Keng, Lok Boon; Xuechuan, Shan
- 文件大小342.79KB
- 发表时间2007
- DOI10.1109/eptc.2007.4469715
- 页码510-513
High-voltage high input impedance unity-gain voltage bufferJankowski, Mariusz; Napieralski, Andrzej · Microelectronics Journal · 2013
[IEEE 2016 21st International Conference on Microwave, Radar and Wireless Communications (MIKON) - Krakow, Poland (2016.5.9-2016.5.11)] 2016 21st International Conference on Microwave, Radar and Wireless Communications (MIKON) - Microelectronics in Poland - from accelerators to space technologyJankowski, Mariusz; Zubert, Mariusz; Napieralski, Andrzej · 2016
[IEEE 2015 MIXDES - 22nd International Conference "Mixed Design of Integrated Circuits & Systems" - Torun, Poland (2015.6.25-2015.6.27)] 2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES) - Mixed signal ASIC controller for satellite medium power DC/DC convertersSkup, Konrad R.; Orleanski, Piotr; Nowosielski, Witold; Jankowski, Mariusz; Jablonski, Grzegorz; Starzak, Lukasz; Szermer, Michal; Napieralski, Andrzej; Darakchiev, Radoslav; Mroczkowski, Mateusz · 2015
[IEEE 2018 XIV-th International Conference on Perspective Technologies and Methods in MEMS Design (MEMSTECH) - Lviv, Ukraine (2018.4.18-2018.4.22)] 2018 XIV-th International Conference on Perspective Technologies and Methods in MEMS Design (MEMSTECH) - Fully differential read-out circuitry components for MEMS-based accelerometersJankowski, Mariusz; Zajac, Piotr; Napieralski, Andrzej · 2018