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[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Multi Physics Modelling of the Electrodeposition Process

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Multi Physics Modelling of the Electrodeposition Process

Hughes, M.; Bailey, C.; McManus, K.
  • 作者Hughes, M.; Bailey, C.; McManus, K.
  • 文件大小8737.58KB
  • 发表时间2007
  • DOI10.1109/esime.2007.359961
  • 页码1-8
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