[IEEE 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Hsinchu, Taiwan (2007.04.23-2007.04.25)] 2007 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) - Barriermetal-less interconnect with low-k organic film
Maeda, Nobuhide; Takimoto, Yoshio; Sakamoto, Yoshinori; Tada, Masahiro; Nakajima, Michio; Funatsu, Keisuke
- 作者Maeda, Nobuhide; Takimoto, Yoshio; Sakamoto, Yoshinori; Tada, Masahiro; Nakajima, Michio; Funatsu, Keisuke
- 文件大小1878.93KB
- 发表时间2007
- DOI10.1109/vtsa.2007.378959
- 页码1-2