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[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - A novel packaging process for open-channel sensors

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - A novel packaging process for open-channel sensors

Chung-Yi Hsu, ; Lung-Tai Chen, ; Jin-Sheng Chang, ; Chun-Hsun Chu,

作者Chung-Yi Hsu, ; Lung-Tai Chen, ; Jin-Sheng Chang, ; Chun-Hsun Chu,
文件大小293.13KB
发表时间2007
DOI10.1109/impact.2007.4433612
页码258-261

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