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[IEEE 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Budapest, Hungary (2007.09.17-2007.09.19)] 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Thermal challenges in 3-D stacked packaging

[IEEE 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Budapest, Hungary (2007.09.17-2007.09.19)] 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC) - Thermal challenges in 3-D stacked packaging

Natarajan, Venkat
  • 作者Natarajan, Venkat
  • 文件大小649.80KB
  • 发表时间2007
  • DOI10.1109/therminic.2007.4451736
  • 页码1-1
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