SPIE Proceedings [SPIE 3rd International Symposium on Advanced Optical Manufacturing and testing technologies: Optical test and Measurement Technology and Equipment - Chengdu, China (Sunday 8 July 2007)] 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment - Process, reliability test, and interfacial characterization for low temperature wafer direct bonding
- 作者Lin, Xiaohui; Pan, Junhua; Wyant, James C.; Shi, Tielin; Tang, Zirong; Wang, Hexin; Liao, Guanglan; Nie, Lei
- 卷第6723卷
- 印刷ISSN0277-786X
- 文件大小562.52KB
- 发表时间2007
- DOI10.1117/12.783385
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