Electrical measurement of a lead-free solder assembly after environmental tests by SEM internal probing
T. I. Shih; Y. C. Lin; J. G. Duh; Tom Hsu; W. S. Wu
- 作者T. I. Shih; Y. C. Lin; J. G. Duh; Tom Hsu; W. S. Wu
- 卷第59卷
- 期第7期
- 印刷ISSN1047-4838
- 电子ISSN1543-1851
- 文件大小853.60KB
- 发表时间2007-07
- DOI10.1007/s11837-007-0086-4
- 页码32-37