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Mesomechanical modelling of SnAgCu solder joints in flip chip

Mesomechanical modelling of SnAgCu solder joints in flip chip

Jicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt

作者Jicheng Gong; Changqing Liu; Paul P. Conway; Vadim V. Silberschmidt
卷第43卷
期第1期
印刷ISSN0927-0256
文件大小2082.21KB
发表时间2008
DOI10.1016/j.commatsci.2007.07.039

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